Fact Source: Financial Supervisory Service DART
💡 3-Second Summary
Hanmi Semiconductor disclosed its ‘2025 Corporate Value-Up Plan’, outlining major achievements, market leadership targets, next-generation equipment launch roadmaps, and governance enhancement goals.
📊 [Key Disclosure Contents & Summary of Major Figures]
- Plan Name
- 2025 Hanmi Semiconductor Corporate Value-Up Plan
- Key Details
- Recognition as ‘Top Supplier’ by Micron
- Providing close local support through the establishment of Hanmi Taiwan and Hanmi Singapore subsidiaries
- Selection of TC Bonder as a World Class Product & Market Share Status
- 90% global market share based on HBM3e (as of 2024)
- Target market share of 95% for HBM4 & HBM5 TC bonders
- 71.2% global market share for HBM production TC bonders in 2025
- Export Achievements & Overseas Revenue Ratio
- Received the $300 Million Export Tower Award
- Maintained an average overseas revenue ratio of approx. 70% over the past 10 years
- Expansion of Business & Equipment Lines
- Key supplier of EMI shield equipment to global aerospace companies (supplying electromagnetic shielding equipment for space exploration rockets and communication satellites)
- Governance Improvements
- Target to double compliance rate for key metrics in the 2026 Corporate Governance Report compared to the previous year
- New Equipment Release Roadmap & Capital Investment
- Scheduled launch of Wide TC Bonder in H2 2026
- Scheduled launch of Hybrid Bonder in 2028
- Construction of ‘Hybrid Bonder Factory’ (Factory 7) underway for next-generation ‘Wide TC Bonder’ used in wide-type HBM production
- Decision Date & Other Details
- Board Resolution Date: 2025-12-26
- Related Materials Publication Date: 2025-12-26
- Note: Contents contain forward-looking statements and future plans, which are subject to change based on market conditions and changes in the business environment.
📝 Editor’s Comment (Key Follow-up Checkpoint)
📌 Verification of Key Value-Up Plan Progress and Roadmap Execution
This voluntary disclosure details key initiatives for corporate value enhancement, including next-generation equipment launch schedules, factory construction, and corporate governance goals. Checking the progress of the Wide TC Bonder release, the construction status of the Hybrid Bonder Factory, and compliance with governance metrics is important to verify the implementation of the outlined plans. Related developments can be verified through future periodic reports, corporate governance reports, or subsequent voluntary disclosures.
📢 Disclaimer & Source Notice
Source: This content was structured and newly generated based on official submission data from the Financial Supervisory Service’s Data Analysis, Retrieval and Transfer System (DART).
Investment Risk Warning: This content is provided solely for informational and linguistic reference purposes. Under no circumstances does it constitute financial advice or a recommendation to buy or sell specific stocks. All investment decisions and financial responsibilities rest entirely with the investor.
Contact: For compliance inquiries or copyright concerns, please contact ksb220805@gmail.com.
