Fact Source: Financial Supervisory Service DART
💡 3-Second Summary
The company will hold a conference call IR session sponsored by Nomura Securities for major overseas institutional investors across the Americas, Europe, and Asia to present its Q3 2024 business performance, TC Bonder demand diversification, and dedicated HBM chip market growth.
📊 [Key Disclosure Contents & Summary of Major Figures]
- Date & Location: October 22, 2024 at 10:00 AM / Conference Call
- Target Audience: Major Overseas Institutional Investors (Americas, Europe, Asia, etc.)
- Purpose: Announcement of Q3 2024 Business Performance
- Format: Conference Call
- Sponsoring Institution: Nomura Securities
- Key Presentation Content (Summary):
- Review of Q3 2024 business performance
- Diversification of TC Bonder demand and growth in the dedicated HBM chip market
- Board Resolution/Decision Date: October 21, 2024
- IR Materials: Date and URL not specified
- Other Material Details: Schedule subject to change based on company circumstances
📝 Editor’s Comment (Key Follow-up Checkpoint)
📌 IR Event Execution and Material Verification
This filing serves as a notice announcing the schedule and key discussion topics for an upcoming conference call IR event aimed at major overseas institutional investors. Tracking whether the session is conducted as scheduled on October 22, 2024, and whether any summary presentation materials are subsequently published is important to evaluate disclosed financial performance and market outlook. Relevant updates can be verified through subsequent corporate filings or regular business reports (quarterly, half-year, annual).
📢 Legal Disclaimer & Source Notice
Source: This content was structured and newly generated based on official filing data from the Financial Supervisory Service DART system.
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