Fact Source: Financial Supervisory Service DART
💡 3-Second Summary
Hanmi Semiconductor will host an IR event sponsored by LS Securities to present its 2H 2026 outlook and expansion plans into new markets, including new equipment launches for AI system semiconductors, to major domestic institutional investors.
📊 [Key Disclosure Contents & Summary of Major Figures]
- Event Overview
- Event Purpose: 2H 2026 Outlook and Expansion into Overseas New Markets
- Date: 2026-06-04
- Location: Seoul, Korea
- Sponsor: LS Securities
- Meeting Format: Group Meetings
- Target Audience: Major domestic institutional investors
- Key Presentation Topics
- Entry into AI System Semiconductor Market (Foundry, OSAT): Release of 2.5D Package TC Bonder (40/120)
- Entry into HBF (High Bandwidth Flash) Market: Release of a new concept TC Bonder responding to growing AI semiconductor memory demand
- Participation in U.S.-led AI Semiconductor Alliance: Meeting AI packaging equipment demand for big tech, memory, and foundry partners
- Resolution Date & Other Details
- Decision Date: 2026-06-01
- Note: The event schedule is subject to change depending on company circumstances.
📝 Editor’s Comment (Key Follow-up Checkpoint)
📌 Verification of Official IR Presentation Materials and Subsequent Disclosures
This IR event serves to present the second-half outlook and strategic growth initiatives, such as new equipment launches, to major domestic institutional investors. Checking official presentation materials or subsequent disclosures published after the event is important to verify how the outlined plans are formally communicated. Related updates can be verified through future IR presentation materials, corporate disclosures, or periodic reports.
📢 Disclaimer & Source Notice
Source: This content was structured and newly generated based on official submission data from the Financial Supervisory Service’s Data Analysis, Retrieval and Transfer System (DART).
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