Fact Source: Financial Supervisory Service DART
💡 3-Second Summary
Hanmi Semiconductor will host an IR event sponsored by Nomura Securities in Las Vegas and New York, USA, to present its business status, including TC Bonder demand expansion across memory semiconductors and new equipment launch roadmaps, to major overseas institutional investors.
📊 [Key Disclosure Contents & Summary of Major Figures]
- Event Overview
- Event Purpose: Participation in Nomura@CES 2026 and US Non-Deal Roadshow (NDR)
- Date & Time: 2026-01-05
- Location: USA (Las Vegas, New York)
- Sponsor: Nomura Securities
- Meeting Format: Group meetings and 1-on-1 meetings
- Target Audience: Major overseas institutional investors
- Key Presentation Topics
- 2026 as the inaugural year of global growth
- Expansion of TC BONDER demand across memory semiconductors (HBM, Graphic DDR, HBF, SOCAMM)
- Wide TC BONDER (HBM5, HBM6) roadmap
- Increase in EMI Shield equipment sales driven by the expansion of space exploration rockets and LEO satellite communications
- Decision Date & Other Details
- Board Resolution Date: 2025-12-30
- Note: The event schedule is subject to change depending on company circumstances.
📝 Editor’s Comment (Key Follow-up Checkpoint)
📌 Verification of Official IR Presentation Materials and Subsequent Disclosures
This IR event serves to outline current business developments, including equipment demand expansion across memory semiconductors and new product roadmaps, to major overseas institutional investors through Nomura@CES 2026 and the US NDR. Checking official presentation materials or subsequent disclosures published after the event is important to verify how the outlined plans are formally communicated. Related updates can be verified through future IR presentation materials, corporate disclosures, or periodic reports.
📢 Disclaimer & Source Notice
Source: This content was structured and newly generated based on official submission data from the Financial Supervisory Service’s Data Analysis, Retrieval and Transfer System (DART).
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