Fact Source: Financial Supervisory Service DART
💡 3-Second Summary
Hanmi Semiconductor has signed a supply contract worth KRW 44.2B with SK Hynix for ‘TC BONDER 4.5 GRIFFIN’ equipment used in manufacturing HBM4.
📊 [Key Disclosure Contents & Summary of Major Figures]
- Contract Overview
- Contract Title: Order for ‘TC BONDER 4.5 GRIFFIN’ equipment for HBM4 manufacturing
- Contract Type: Other Sales/Supply Contract
- Counterparty: SK Hynix Inc.
- Supply Region: Korea
- Contract Amount & Scale
- Contract Amount: KRW 44.2B (Excluding VAT)
- Recent Annual Revenue: KRW 576.7B (2025 consolidated basis)
- Ratio to Revenue: 7.66%
- Contract Period & Timeline
- Contract Start Date: 2026-06-08
- Contract End Date (Delivery Date): 2026-09-02
- Contract Date: 2026-06-08 (Based on Purchase Order receipt date)
- Other Details
- Down Payment / Advance Payment: None
- The contract end date is subject to change based on mutual agreement with the customer.
📝 Editor’s Comment (Key Follow-up Checkpoint)
📌 Verification of Delivery Schedule and Revenue Recognition Timing
This contract is a short-term supply agreement with an expected delivery date of September 2, 2026, which may be subject to change upon consultation with the client. Checking whether equipment delivery and inspection are completed as scheduled and properly reflected in the corresponding quarter’s financial results is important to understand the actual revenue recognition timing and financial performance. Related progress and confirmed financials can be verified through future periodic reports, financial statements, or subsequent disclosures.
📢 Disclaimer & Source Notice
Source: This content was structured and newly generated based on official submission data from the Financial Supervisory Service’s Data Analysis, Retrieval and Transfer System (DART).
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