[Disclosure] Hanmi Semiconductor (042700) Invades Hong Kong Financial Hub! Partners with Macquarie to Launch Global Roadshow for ‘U.S.-Led AI Alliance’

Source Fact: Financial Supervisory Service Electronic Disclosure System (DART) / 2026-05-15

Disclosure Type: Holding of Investor Relations (IR) (Announcement Disclosure)

💡 3-Second Summary

Heading into Asia’s premier financial hub, Hanmi Semiconductor is participating in the Macquarie Asia Conference in Hong Kong to pitch its strategic inclusion in the U.S.-led ‘AI Semiconductor Alliance’ and its next-gen tech pipeline directly to global institutional whales.

📊 1. [Key Disclosure Content & Major Figures Summary]

• Date & Location: May 18 ~ May 20, 2026 (3-day event), Hong Kong
• Target Attendees: Major overseas institutional investors
• Purpose: Participation in the ‘Macquarie Asia Conference 2026’ sponsored by global investment banking titan Macquarie Securities to accelerate foreign capital inflow and expand global investor alignment.
• Format: One-on-One and Group Meetings
• Key Presentation Summary (3 Core Global AI Strategies):
  1. Entering the AI System Semiconductor Market: Commercializing high-spec ‘2.5D Package TC Bonders (Models 40 & 120)’ specifically engineered for Foundry and OSAT clients.
  2. Pioneering the HBF (High Bandwidth Flash) Sector: Debuting an entirely new concept in TC bonding infrastructure designed to capture diversifying AI memory demands.
  3. Penetrating the U.S.-Led AI Semiconductor Market: Joining the U.S.-centric AI supply chain network linking Big Tech, memory, and foundry giants to systematically address cross-industry packaging equipment demands.

📈 2. [Expert View: Market & Stock Price Impact Analysis]

• Institutional Alignment in Asia’s Financial Capital (Short-term Positive Catalyst): This IR roadshow is highly constructive as it takes place directly in Hong Kong, targeting the core of Asia’s long-only global funds. Actively selling their thesis of joining the “U.S.-led AI Semiconductor Alliance” directly to premium international managers serves as a prominent bullish catalyst to expand foreign ownership and trigger foreign net buying in the near term.
• Structural Diversification Beyond Core Memory (Long-term Fundamental Expansion): Showcasing foundry/OSAT-bound 2.5D package bonders and next-gen HBF bonders proves Hanmi is successfully mitigating its historical memory-dependent exposure risks. Transitioning into the비메모리 (non-memory) and flash sectors provides international research firms with strong justification to re-rate Hanmi’s valuation multiple away from traditional domestic peers and closer to premium global equipment peers.

📝 Editor’s Comment (by K-STOCK Editor)

Hanmi Semiconductor is scaling up the playground, taking its growth thesis straight to the heart of Asia’s financial powerhouse—Hong Kong! Backed by Macquarie hosting the stage, Hanmi is walking straight up to global tier-1 whales to flex its role in the ‘U.S.-led AI Semiconductor Alliance’. This isn’t just local hype anymore; they are stepping into the ring with mega-caps like Nvidia and TSMC. Armed with new foundry-bound 2.5D package bonders and an aggressively fresh ‘HBF (High Bandwidth Flash)’ tool pipeline, this is a flawless global expansion narrative that trading boards and tech subreddits will absolutely eat up. As the conference fires up on May 18, the global institutional market vibe is bound to get scorching hot.

📢 Disclaimer & Source Information

• Source: This content was newly structured and written based on official data submitted to the Financial Supervisory Service Electronic Disclosure System (DART).
• Investment Risk Notice: This information is provided solely for informational and linguistic reference purposes. Under no circumstances does it constitute financial advice or a recommendation to buy or sell specific stocks. All investment decisions and financial responsibilities rest entirely with the investor.
• Contact: For compliance inquiries or copyright requests, please contact ksb220805@gmail.com.