Fact Source: Financial Supervisory Service DART
💡 3-Second Summary
Hanmi Semiconductor signed a supply contract worth KRW 9.65 billion with SK Hynix for ‘TC BONDER’ equipment used in HBM manufacturing, representing 1.73% of its recent annual revenue.
📊 [Key Disclosure Contents & Summary of Major Figures]
- Contract Overview
- Contract Name: Purchase order for ‘TC BONDER’ equipment for HBM manufacturing
- Contract Type: Other sales/supply contract
- Counterparty: SK Hynix Inc.
- Supply Region: South Korea
- Contract Amount & Financial Ratio
- Contract Amount: KRW 9,650,000,000 (KRW 9.65B, excluding VAT)
- Recent Annual Revenue: KRW 558,917,191,547 (2024 consolidated revenue)
- Ratio to Recent Revenue: 1.73%
- Contract Period & Key Terms
- Contract Period: 2026-01-14 ~ 2026-04-01
- Order Date: 2026-01-14 (Date of purchase order receipt)
- Advance Payment: None
- Note: The contract end date (delivery date) is subject to change based on mutual agreement with the client.
📝 Editor’s Comment (Key Follow-up Checkpoint)
📌 Verification of Contract Execution and Delivery Schedule
This disclosure details a voluntary supply contract for TC Bonder equipment used in HBM manufacturing with SK Hynix. Checking whether equipment delivery is completed within the specified contract period is important to confirm the actual revenue recognition process. Related updates can be verified through future periodic reports (quarterly/half-year/annual reports) or subsequent contract amendment disclosures.
📢 Disclaimer & Source Notice
Source: This content was structured and newly generated based on official submission data from the Financial Supervisory Service’s Data Analysis, Retrieval and Transfer System (DART).
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