[Disclosure] Hanmi Semiconductor (042700) Hits Morgan Stanley ‘Asia Pacific Summit’, Presenting Next-Gen ‘Wide TC Bonder’ Frameworks to International Whales

Source Fact: Korea Exchange (KRX) & Financial Supervisory Service Electronic Disclosure System (DART) / 2025-11-14

Disclosure Type: Holding of Investor Relations (IR) (Announcement Disclosure)

💡 3-Second Summary

Joining forces with Wall Street investment banking titan Morgan Stanley for its prestigious summit in Singapore, Hanmi Semiconductor is set to pitch its multi-market TC bonder expansion into GDDR/HBF and unveil its highly anticipated ‘Wide TC Bonder’ roadmap optimized for next-gen AI packaging directly to international institutional whales.

📊 1. [Key Disclosure Content & Major Figures Summary]

• Date & Location: November 20, 2025, Singapore
• Target Attendees: Major overseas institutional investors (Focusing on tier-1 tech asset managers from the U.S., Europe, and Asia)
• Purpose: Strategic presentation at the ‘2025 Asia Pacific Summit’ sponsored by global powerhouse Morgan Stanley to accelerate international capital inflow and elevate global technology visibility.
• Format: One-on-One and Face-to-Face Group Meetings
• Key Presentation Summary (Strategic Blueprints for 2026 Global Growth):
  1. Full-Scale Diversification of TC Bonder Deployment: Expanding beyond standard memory HBM tools to encompass high-performance ‘GDDR’ and advanced NAND-stacking ‘HBF (High Bandwidth Flash)’ architectures to capture the entire cross-industry stacked memory ecosystem.
  2. Preemptive Response to AI Packaging Architectural Shifts: Detailing precise development schedules for the custom-engineered ‘Wide TC Bonder’, designed specifically to handle expanding lateral chip die form factors in the next-generation AI hardware super-cycle.

📈 2. [Expert View: Market & Stock Price Impact Analysis]

• Securing Long-Only Western Capital via Morgan Stanley Premium Channel (Powerful Near-Term Catalyst): Serving as a headline player at Morgan Stanley’s elite institutional Asia Pacific Summit—the primary gateway for large global funds structuring their year-end and early-year allocations—is an exceptional technical catalyst. Actively presenting their high-margin growth thesis directly to international asset managers on the global stage will serve as a prominent bullish driver to expand foreign ownership density and trigger aggressive foreign net buying.
• Structural Metamorphosis into a Global Tech Infrastructure Leader (Long-Term Fundamental Expansion): The fundamental strength of this filing lies in its clear technological response to cyclical single-sector peak anxieties. Formally expanding its tool application footprint into GDDR and HBF domains alongside clear roadmaps for the ‘Wide TC Bonder’ guarantees that Hanmi’s near-monopoly positioning will extend deep into the next-gen advanced packaging cycle. Crucially, addressing the physical form factor scaling of future AI chips redefines the equity’s core identity. Transitioning from a single memory-tool provider to a global AI tech infrastructure titan provides international research firms with clear justification to re-rate long-term valuation multiples higher.

📝 Editor’s Comment (by K-STOCK Editor)

Hanmi Semiconductor is turning up the volume globally, taking its explosive growth thesis straight to global tier-1 institutional whales at the Morgan Stanley Asia Pacific Summit in Singapore! Hosted through Wall Street’s elite channels, Hanmi is walking out to showcase a hardware pipeline packed with mega-catalysts that will get macro fund managers incredibly hyped. They are completely flattening cyclical single-sector HBM fears by announcing a formal tool takeover into GDDR and HBF sub-sectors, topped off with a grand reveal of the ultimate holy grail—the ‘Wide TC Bonder’. This is a flawless, high-velocity narrative that international trading boards and tech subreddits will absolutely eat up. As the meetings go live on November 20, expect the global institutional market vibe to get scorching hot.

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