Fact Source: Financial Supervisory Service DART
💡 3-Second Summary
Hanmi Semiconductor will participate in ‘Asia Tech Tour 2025’ sponsored by Goldman Sachs to present its 2026 global growth strategy, TC Bonder market expansion, and Wide TC Bonder roadmap to major overseas institutional investors.
📊 [Key Disclosure Contents & Summary of Major Figures]
- Event Overview
- Event Purpose: Participation in ‘Asia Tech Tour 2025’
- Date & Time: 2025-12-11
- Location: Seoul
- Sponsor: Goldman Sachs
- Meeting Format: Group Meetings
- Target Audience: Major overseas institutional investors
- Key Presentation Topics
- Hanmi Semiconductor’s global growth strategy for 2026
- Expansion of TC Bonder application across the entire memory semiconductor market
- HBM, Graphic DDR, HBF (High Bandwidth Flash)
- Presentation of Wide TC Bonder roadmap in response to changing AI semiconductor packaging standards
- Decision Date & Other Details
- Board Resolution Date: 2025-12-10
- Note: The event schedule is subject to change depending on company circumstances.
📝 Editor’s Comment (Key Follow-up Checkpoint)
📌 Verification of Official IR Presentation Materials and Subsequent Disclosures
This IR event serves to present the 2026 growth strategy and next-generation equipment roadmaps to major overseas institutional investors through ‘Asia Tech Tour 2025’. Checking official presentation materials or subsequent disclosures published after the event is important to verify how the presented information is formally communicated. Related updates can be verified through future IR presentation materials, corporate disclosures, or periodic reports.
📢 Disclaimer & Source Notice
Source: This content was structured and newly generated based on official submission data from the Financial Supervisory Service’s Data Analysis, Retrieval and Transfer System (DART).
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