[Disclosure] Hanmi Semiconductor (042700) Targets Global Big Hands! Unveils 2.5D Package and Next-Gen ‘HBF TC Bonder’ to Worldwide Investors

Source Fact: Financial Supervisory Service Electronic Disclosure System (DART) / 2026-06-22

Disclosure Type: Holding of Investor Relations (IR) (Aunouncement Disclosure)

💡 3-Second Summary

Hanmi Semiconductor is embarking on a major investor roadshow targeting overseas institutional investors to officially present its new ‘2.5D Package TC Bonder’, the newly concepted ‘HBF TC Bonder’ line-up, and its strategic expansion plans into the U.S. aerospace and AI packaging markets.

📊 1. [Key Disclosure Content & Major Figures Summary]

• Date & Location: June 23, 2026, Seoul, South Korea
• Target Attendees: Major overseas institutional investors
• Purpose: Participation in the ‘2026 CITIC CLSA Northeast Asia Forum’ hosted by CLSA Securities to enhance corporate value and strengthen investor communication.
• Format: One-on-One and Group Meetings
• Key Presentation Summary (3 Strategic Roadmaps):
  1. Entry into AI System Semiconductor Markets: Official launch of the newly developed ‘2.5D Package TC Bonder (Models 40 and 120)’ targeting Foundries and OSATs.
  2. Supply of HBF (High Bandwidth Flash) TC Bonders: Unveiling a new concept in TC bonding equipment designed to capture surging AI memory demands.
  3. U.S. Market Penetration: Full-scale entry into the U.S. semiconductor ecosystem including ‘Tera Fab’ to address growing equipment demands in AI and aerospace packaging.

📈 2. [Expert View: Market & Stock Price Impact Analysis]

• Short-term Momentum: Unveiling of the New Equipment Pipeline: Instead of relying solely on existing HBM-related equipment narratives, officially revealing the blueprints for ‘2.5D Package Bonders’ and ‘HBF Bonders’ to global fund managers is expected to serve as a highly positive catalyst for short-term stock price momentum.
• Long-term Valuation Re-rating (Multiple Expansion): This IR announcement goes beyond a routine investor meeting by presenting an explicit product diversification strategy. Tying up with the U.S. Tera Fab to expand into the aerospace industry signals an effort to mitigate single-customer concentration risks in the memory sector. This fundamental improvement in technology and target markets provides institutional research firms with solid justification for upgrading long-term price targets, rendering this disclosure a highly constructive growth indicator.

📝 Editor’s Comment (by K-STOCK Editor)

Hanmi Semiconductor is officially unlocking its next-gen arsenal for global whales and institutional traders! Dropping these massive catalysts at the CLSA Forum means they are ready to show the world that their growth runway is just getting started. This isn’t just a generic investor pitch; they are introducing a game-changing 2.5D package bonder for foundries and an entirely new ‘HBF (High Bandwidth Flash) TC Bonder’ concept. Top it off with a grand plan to conquer the U.S. aerospace and AI packaging markets via Tera Fab, and you have a growth story that global tech investors have been craving. The market vibe is heating up as the firm proves it can expand way beyond traditional memory applications.

📢 Disclaimer & Source Information

• Source: This content was newly structured and written based on official data submitted to the Financial Supervisory Service Electronic Disclosure System (DART).
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