[Disclosure] HANMI Semiconductor (042700) to Hold Investor Relations (IR) Conference on Q2 2026 Results and Global Expansion Strategy

Fact Source: Financial Supervisory Service (DART) / 2026-07-15

Disclosure Type: Holding of Investor Relations (IR) (Information Disclosure)

💡 3-Second Summary

HANMI Semiconductor has scheduled a group conference call IR event for major overseas institutional investors on July 16, 2026, to review its Q2 2026 business results and share plans on new AI packaging equipment, HBM4 demand response, and U.S. market expansion.

📊 1. [Summary of Core Disclosure Content and Major Figures]

• Date & Time: July 16, 2026 (Time unspecified)
• Venue & Method: BofA (Bank of America: Merrill Lynch Securities) Office / Group Conference Call
• Participants: Major Overseas Institutional Investors
• Sponsor: BofA (Bank of America: Merrill Lynch Securities)
• Decision Date: July 15, 2026
• Core Agenda & Presentation Summary:
  1. Review of Q2 2026 business results
  2. Strengthening AI system semiconductor 2.5D packaging equipment line: Launch of 2.5D TC Bonder (40·120) / Launch of FC BONDER 3.5
  3. Responding to TC Bonder demand from global memory customers expanding HBM4 facility investments
  4. U.S. semiconductor market entry: Addressing demand for HBM TC Bonders, AI packaging, and aerospace packaging equipment

📈 2. [Expert Perspective: What This Disclosure Means for Investors]

• Outreach to Global Institutional Investors: This disclosure registers that HANMI Semiconductor is utilizing a global financial institution (BofA) to establish direct communication lines with overseas institutional investors to present its second-quarter operational outcomes and key business strategies.
• Product Portfolio and Market Strategies Outlined: The company has explicitly outlined forward-looking plans, including the launch of its new 2.5D TC Bonder and FC BONDER 3.5 lines, plans to secure demand amid the expansion of global HBM4 investments, and targeted expansion into the U.S. market for AI and aerospace packaging.
• No Financial Performance Causes Specified: This voluntary filing serves purely as an administrative notice regarding the IR event. It does not contain preliminary financial figures or concrete causes for financial fluctuations for the quarter.

📝 Editor’s Comment (by K-STOCK Editor)

HANMI Semiconductor’s recent filing announces an Investor Relations event on July 16, targeted at major overseas institutional investors to review second-quarter performance and clarify its roadmap for new packaging equipment launches and U.S. market entry. The event is set as a group conference call sponsored by BofA, with the schedule subject to adjustment based on company circumstances.

For investors reviewing this notice, the primary checkpoints are ‘the actual financial results to be presented’ and ‘the concrete details of the product execution timelines.’ Because this voluntary disclosure is limited to the schedule and thematic outlines of the conference with no quantitative financial projections or contracted sales volumes, investors should focus on verifying actual quantitative metrics and order contract filings as they materialize in subsequent official disclosures.

📢 Disclaimer & Source Information

Source: This content was restructured and newly drafted based on the official submitted data from the Financial Supervisory Service (DART).

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