Fact Source: Financial Supervisory Service DART
💡 3-Second Summary
Hanmi Semiconductor has decided to acquire land and buildings in Incheon for approximately KRW 9.88B to expand its production line for HBM TC Bonders.
📊 [Key Disclosure Details & Financial Figures Summary]
- Acquired Asset & Counterparty
- Acquired Property: All land and buildings located at 552-31 Gajwa-dong, Seo-gu, Incheon, South Korea
- Land Area: 2,815.6 ㎡
- Building Area: 2,336.4 ㎡
- Transaction Counterparty: GNM Life Co., Ltd.
- Acquisition Amount & Financial Ratio
- Acquisition Amount: KRW 9,880,000,000 (KRW 9.88B)
- Total Assets (as of Dec 31, 2023, Consolidated): KRW 723,839,103,741 (KRW 723.84B)
- Acquisition Amount to Total Assets Ratio: 1.36%
- Note: The acquisition amount reflects the contract price excluding taxes, duties, and incidental expenses.
- Purpose & Schedule
- Purpose of Acquisition: Expansion of TC Bonder production lines for High Bandwidth Memory (HBM)
- Board Resolution Date: May 14, 2024 (1 Outside Director attended, Statutory Auditor attended)
- Scheduled Acquisition Date: June 10, 2024 (Scheduled final payment date)
- Note: Schedule and payment terms are subject to change upon mutual agreement with the counterparty.
📝 Editor’s Comment (Key Follow-up Checkpoint)
📌 Completion of Final Payment on Scheduled Acquisition Date
This tangible asset acquisition is set to be completed with the balance payment on the scheduled acquisition date of June 10, 2024. Confirming whether the payment is completed as scheduled is important for determining whether the transaction has been officially finalized. The actual progress can be verified in upcoming periodic disclosures, such as Quarterly Reports, Semiannual Reports, Annual Reports, or subsequent public filings.
📢 Disclaimer and Source Notice
Source: This content was newly structured and created based on officially submitted data from the Data Analysis, Retrieval and Transfer System (DART) of the Financial Supervisory Service.
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