Fact Source: Financial Supervisory Service DART
💡 3-Second Summary
Hanmi Semiconductor has signed a supply contract worth approximately KRW 22.59B with MICRON in Taiwan for ‘DUAL TC BONDER TIGER’ equipment used in HBM manufacturing.
📊 [Key Disclosure Details & Financial Figures Summary]
- Contract Details & Counterparty
- Contract Name: Order for ‘DUAL TC BONDER TIGER’ equipment for HBM manufacturing
- Contract Counterparty: MICRON
- Sales/Supply Territory: Taiwan
- Contract Amount & Ratio to Recent Revenue
- Contract Amount: KRW 22,591,392,000 (KRW 22.59B / USD 16,680,000)
- Applied Exchange Rate: KRW 1,354.4 per USD (First announced rate by KEB Hana Bank on April 11, 2024)
- Recent Annual Revenue (2023 Consolidated): KRW 159,008,528,366 (KRW 159.01B)
- Ratio to Recent Revenue: 14.21%
- Contract Period & Timeline
- Contract (Order) Date: April 10, 2024 (Date of Purchase Order receipt)
- Contract Period: April 10, 2024 ~ July 08, 2024
- Note: The contract end date (delivery date) is subject to change upon mutual agreement with the customer.
📝 Editor’s Comment (Key Follow-up Checkpoint)
📌 Execution and Delivery Completion by Contract End Date
This disclosure covers an equipment supply contract with MICRON in Taiwan for HBM manufacturing equipment. Verifying whether the equipment delivery is completed as scheduled by the contract end date of July 8, 2024, is important for determining whether the transaction has been officially finalized. The contract execution progress can be verified in upcoming periodic disclosures, such as Quarterly Reports, Semiannual Reports, Annual Reports, or subsequent public filings.
📢 Disclaimer and Source Notice
Source: This content was newly structured and created based on officially submitted data from the Data Analysis, Retrieval and Transfer System (DART) of the Financial Supervisory Service.
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