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[Disclosure] HANMI Semiconductor (042700) Launches New Year US NDR via ‘CES 2025’: Pitching HBM4 Hybrid Bonding Roadmap to Wall Street Big Money

Posted on January 3, 2025July 4, 2026 By K-STOCK Editor No Comments on [Disclosure] HANMI Semiconductor (042700) Launches New Year US NDR via ‘CES 2025’: Pitching HBM4 Hybrid Bonding Roadmap to Wall Street Big Money

Source Fact: Financial Supervisory Service Electronic Disclosure System (DART) / 2025.01.03

Disclosure Type: Report on Investor Relations (IR) Holding

💡 3-Second Summary

In a massive kickoff to fiscal year 2025, HANMI Semiconductor is partnering with global investment banking powerhouse Nomura Securities to launch a multi-city US Non-Deal Roadshow (NDR) bridging Las Vegas and New York. Timed symmetrically with ‘CES 2025’, management will present its absolute global monopoly in the TC Bonder market and detail its unassailable pipeline for next-gen HBM4 Hybrid Bonding to capture massive sovereign wealth and macro fund inflows.

📊 1. [Key Disclosure Content & Summary of Major Figures]

  • IR Timeline & Multi-City Itinerary: Commencing January 6, 2025 / Cross-border deployment across Las Vegas and New York, USA.
  • Target Audience: Tier-1 North American institutional allocators, macro hedge funds, and mega-cap growth portfolio managers.
  • Sponsor & Custodian: Nomura Securities (Nomura International).
  • Program Affiliation: ‘Nomura@CES 2025’ Institutional Forum & Targeted US Non-Deal Roadshow (NDR).
  • Format: High-density physical One-on-One sessions and exclusive institutional group briefings.
  • Core Presentation Agendas:
    • Monopoly Defense: Strategic execution frameworks to successfully lock down and defend its global market dominance in High Bandwidth Memory (HBM) TC Bonders through 2025.
    • Next-Gen Tech Pipeline: Definite production timelines for Fluxless TC Bonders engineered for high-density integration; official engineering roadmaps for Hybrid Bonding, the holy grail of 6th-generation HBM4 architectures.
    • Alternative Revenue Drivers: Accelerated billings for proprietary EMI (Electromagnetic Interference) Shield Tools, riding the secular expansion of the low-Earth-orbit (LEO) satellite communications market and smart hardware.

📈 2. [Expert View: Analysis of Impact on Stock Price]

  • Riding New Year Wall Street Capital to Initiate Structural Inflows (Strong Bullish Driver): Initiating the fiscal calendar inside the core trading desks of New York and Las Vegas is a highly programmatic move to capture Western capital early. The fact that Nomura is backing this extensive NDR indicates that inbound meeting requests from global tier-1 asset managers have reached a critical density. This direct interface will lay down the primary accumulation foundation for international long-only funds, aligning perfectly with HANMI’s subsequent blockbuster Q1 guidance (90% international mix, 49% operating margin).
  • Codifying the HBM4 Hybrid Bonding Moat to Dispel Overvaluation Anxieties: The absolute technical highlight of this disclosure is the formalization of the Hybrid Bonding timeline. As the industry transitions to HBM4, eliminating traditional micro-bumps via direct copper-to-copper dielectric bonding becomes non-negotiable. Proving to Western big money that HANMI is already steering the development curve for hybrid nodes structurally de-risks terminal valuation concerns, establishing an ironclad re-rating baseline for the stock.

📝 Editor’s Comment (by K-STOCK Editor)

HANMI Semiconductor is pulling out the heavy artillery, flanking itself with global finance giant Nomura to completely take over the institutional trading desks of New York and Las Vegas right at the start of the year! The sheer density of the technical catalysts management is dropping on global portfolio managers is absolute madness. Walking into closed-door rooms backed by an unshakable confidence to defend their HBM bonder monopoly through 2025 is just the opening act. They are taking the stage clutching the holy grail of advanced packaging: the official pipeline for HBM4 Hybrid Bonders and highly sought-after EMI Shield architectures optimized for the satellite space boom. With global long-only “beasts” desperate to maximize exposure to the core AI infrastructure value chain, this disclosure flashes an undeniable green light to back up the truck. To the moon!

📢 Disclaimer and Source Information

  • Source: This content has been structured and newly written based on official data submitted to the Financial Supervisory Service’s Electronic Disclosure System (DART).
  • Investment Risk Notice: This content is provided solely for informational and linguistic reference purposes. Under no circumstances does it constitute financial advice or a recommendation to buy or sell specific stocks. All investment decisions and financial responsibilities rest entirely with the investor.
  • Contact: For compliance inquiries or copyright requests, please contact ksb220805@gmail.com.
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