[Disclosure] Hanmi Semiconductor (042700) Invades Southeast Asian Tech Hubs! Targets Singapore and Malaysia Capital with Next-Gen HBM6 Roadmap

Source Fact: Financial Supervisory Service Electronic Disclosure System (DART) / 2026-04-10

Disclosure Type: Holding of Investor Relations (IR) (Announcement Disclosure)

💡 3-Second Summary

Heading straight into Southeast Asia’s financial and back-end manufacturing strongholds, Hanmi Semiconductor is embarking on an institutional roadshow in Singapore and Malaysia to pitch its next-gen ‘Wide TC Bonder’ for HBM6 and high-margin aerospace tool pipelines.

📊 1. [Key Disclosure Content & Major Figures Summary]

• Date & Location: April 20 ~ April 23, 2026 (4-day event)
  • April 20 ~ April 21: Malaysia
  • April 22 ~ April 23: Singapore
• Target Attendees: Major overseas institutional investors
• Purpose: Participation in the ‘Macquarie Asia Conference 2026’ sponsored by global investment banking titan Macquarie Securities to accelerate international capital inflow and bolster global investor alignment.
• Format: One-on-One and Group Meetings
• Key Presentation Summary (3 Core Strategic Growth Pillars):
  1. Full-Scale Diversification of TC Bonder Pipeline: Expanding beyond standard HBM/HBF tools to foundry-bound ‘2.5D Package TC Bonders’ and ‘BOC/COB Bonders’ for premium graphic (GDDR) and NAND stacking.
  2. Next-Gen Equipment Launch Roadmap: Detailing precise development schedules for the ‘Wide TC Bonder’ (optimized for HBM5 & HBM6) and advanced ‘Hybrid Bonder’ systems.
  3. Expansion of EMI (Electromagnetic Interference) Shield Pipeline: Capitalizing on surging equipment orders from global aerospace, satellite communication, defense drones, and premium smartphones.

📈 2. [Expert View: Market & Stock Price Impact Analysis]

• Simultaneous Alignment with Sovereign Capital and OSAT Hubs (Powerful Near-Term Catalyst): This international roadshow is highly constructive as it connects Singapore’s massive sovereign wealth managers (e.g., GIC, Temasek) with Malaysia’s dense semiconductor packaging (OSAT) ecosystem. Actively demonstrating corporate metrics across these hubs serves as a prominent bullish catalyst to expand foreign ownership and trigger foreign net buying, lifting the equity out of its recent consolidation phase.
• Structural Portfolio Evolution Enhances Valuation Lower Bound (Long-Term Fundamental Expansion): The fundamental strength of this filing lies in its clear technological response to cyclical peak anxieties. Solidifying the development timeline for the ‘Wide TC Bonder’ and ‘Hybrid Bonder’ systems effectively guarantees that Hanmi’s near-monopoly positioning will extend deep into the HBM6 super-cycle. Crucially, formalizing the expansion of EMI shield tools into the aerospace and satellite fields establishes robust secular revenue diversification beyond core memory volatility. This multi-market footprint provides international research firms with strong justification to re-rate long-term valuation multiples higher.

📝 Editor’s Comment (by K-STOCK Editor)

Hanmi Semiconductor’s upcoming roadshow across Singapore and Malaysia is a calculated, strategic push to capture high-velocity global liquidity and anchor foreign institutional sentiment. The core value of this briefing lies in giving international asset managers explicit visibility into its next-gen architecture, framing its ‘Wide TC Bonder’ and ‘Hybrid Bonder’ systems as a unified transition path. Deploying Wide TC Bonders aggressively to bypass temporary industry bottlenecks in hybrid bonding deployment while refining its next-gen hybrid tools in parallel constitutes an incredibly robust two-track strategy. Complemented by growing demand for aerospace and satellite-bound EMI shields, Hanmi is systematically reinforcing its financial downside protection. Tracking this multi-market institutional expansion remains the most rational approach.

📢 Disclaimer & Source Information

• Source: This content was newly structured and written based on official data submitted to the Financial Supervisory Service Electronic Disclosure System (DART).
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