[Disclosure] Hanmi Semiconductor (042700) Headlines Nomura ‘Tech Tour’, Presenting Next-Gen ‘Hybrid Bonder’ & Aerospace Frameworks to Global Whales

Source Fact: Financial Supervisory Service Electronic Disclosure System (DART) / 2026-02-06

Disclosure Type: Holding of Investor Relations (IR) (Announcement Disclosure)

💡 3-Second Summary

Joining forces with premier global investment bank Nomura Securities for its high-profile ‘Tech Tour’, Hanmi Semiconductor is set to pitch its next-gen ‘Wide TC Bonder’, ‘Hybrid Bonder’ systems, and expanding global demand for aerospace/defense EMI shields directly to international institutional whales.

📊 1. [Key Disclosure Content & Major Figures Summary]

• Date & Location: February 10, 2026 at 13:15 KST, Seoul, South Korea
• Target Attendees: Major overseas institutional investors
• Purpose: Participation in the ‘Tech Tour’ hosted by global investment banking powerhouse Nomura Securities to accelerate international capital inflow and elevate global corporate value visibility.
• Format: Face-to-Face Group Meetings
• Key Presentation Summary (3 Core Strategic Global AI Roadmaps):
  1. Full-Scale Diversification of Advanced Packaging Assets: Expanding beyond standard memory HBM tools to foundry-bound ‘TC Bonders, FC Bonders, and Big Die Bonders’ to systematically capture the entire AI system and memory computing ecosystem.
  2. Next-Gen Equipment Launch Roadmap: Formally establishing precise development schedules for high-spec ‘TC Bonder 4’, the ‘Wide TC Bonder’ (optimized for HBM5 & HBM6), and advanced ‘Hybrid Bonders (for HBM & System Semiconductor)’.
  3. Explosive Expansion of EMI Shield Business: Capturing accelerating structural equipment orders driven by the blooming global aerospace, satellite communications, and defense drone sectors.

📈 2. [Expert View: Market & Stock Price Impact Analysis]

• Securing Long-Only Western Capital via Nomura Infrastructure (Powerful Near-Term Catalyst): Serving as a headline player at Nomura’s premier institutional Tech Tour—the primary gateway for large global funds entering the Korean tech market—is an exceptional technical catalyst. Actively presenting their high-margin growth thesis directly to international asset managers will serve as a prominent bullish driver to expand foreign ownership and trigger aggressive foreign net buying.
• Structural Metamorphosis into a Global Tech Infrastructure Leader (Long-Term Fundamental Expansion): The fundamental strength of this filing lies in its clear technological response to cyclical single-sector (HBM) peak anxieties. Formally introducing Big Die bonders for non-memory clients alongside development paths for the ‘Wide TC Bonder’ and ‘Hybrid Bonder’ systems effectively guarantees that Hanmi’s near-monopoly positioning will extend deep into the next-gen super-cycle. Crucially, anchoring the expansion of EMI shield tools into the global aerospace, satellite, and military drone fields redefines the equity’s core identity. Transitioning from a single memory-tool provider to a global aerospace and AI infrastructure titan provides international research firms with clear justification to re-rate long-term valuation multiples higher.

📝 Editor’s Comment (by K-STOCK Editor)

Hanmi Semiconductor is scaling up the playground big time, taking its explosive growth thesis directly to global tier-1 institutional whales at the Nomura Tech Tour! Hosted through prime global channels, Hanmi is walking out to showcase a pipeline packed with mega-catalysts that will get global macro traders incredibly hyped. They are formally introducing new foundry-bound Big Die tools, the next-gen ‘Wide TC Bonder’, and the ultimate holy grail of advanced packaging—the ‘Hybrid Bonder’. Top it off with a grand plan to conquer the global aerospace, satellite communication, and defense drone markets via their high-margin EMI shield equipment, and you have a flawless global expansion narrative that trading boards and tech subreddits will absolutely eat up. As the meetings go live on February 10, expect the global institutional market vibe to get scorching hot.

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• Source: This content was newly structured and written based on official data submitted to the Financial Supervisory Service Electronic Disclosure System (DART).
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