Fact Source: Financial Supervisory Service DART
💡 3-Second Summary
Hanmi Semiconductor is hosting an IR event for overseas institutional investors to present Q2 2026 financial results, AI semiconductor equipment expansion, and U.S. market entry plans.
📊 [Summary of Key Disclosure Content and Major Figures]
- Date and Location
- Date: 2026-07-16
- Location: BofA (Bank of America / Merrill Lynch) Office
- Target Participants and Sponsor
- Target Participants: Key overseas institutional investors
- Sponsor: BofA (Bank of America / Merrill Lynch)
- Purpose and Format
- Purpose: Announcement of Q2 2026 business performance
- Format: Group conference call
- Key Topics (Summary)
- Review of Q2 2026 business performance
- Reinforcement of 2.5D packaging equipment lineup for AI system semiconductors (Release of 2.5D TC Bonder (40/120) / Release of FC BONDER 3.5)
- Response to TC Bonder demand driven by global memory clients’ HBM4 facility investment expansion
- U.S. semiconductor market expansion (Addressing demand for HBM TC Bonders, AI packaging, and aerospace packaging equipment)
- Board Resolution Date
- 2026-07-15
- Other Important Matters
- The IR event schedule is subject to change based on corporate circumstances.
📝 Editor’s Comment (Key Follow-up Checkpoint)
📌 Verification of Finalized Financial Performance and Presentation Materials Following IR Completion
This disclosure is an event notice to share Q2 performance and business updates with overseas institutional investors. Verifying how the finalized operational results and detailed contents discussed during the IR are reflected in actual financial statements is important for understanding the company’s financial state. Relevant details can be reviewed in subsequent periodic reports (Quarterly Business Reports) or official IR material disclosures.
📢 Disclaimer and Source Information
Source: This content has been newly structured and created based on official data submitted to the Financial Supervisory Service’s Data Analysis, Retrieval and Transfer System (DART).
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