[Disclosure] Hanmi Semiconductor (042700) Hits Goldman Sachs ‘Asia Tech Tour’, Pitching ‘Wide TC Bonder’ Roadmaps to International Whales

Source Fact: Financial Supervisory Service Electronic Disclosure System (DART) / 2025-12-10

Disclosure Type: Holding of Investor Relations (IR) (Announcement Disclosure)

💡 3-Second Summary

Joining forces with global investment banking titan Goldman Sachs for its prestigious conference, Hanmi Semiconductor is set to pitch its multi-market TC bonder expansion into Graphic DDR/HBF and unveil its highly anticipated ‘Wide TC Bonder’ roadmap optimized for next-gen AI packaging directly to international institutional whales.

📊 1. [Key Disclosure Content & Major Figures Summary]

• Date & Location: December 11, 2025, Seoul, South Korea
• Target Attendees: Major overseas institutional investors (Focusing on tier-1 long-only asset managers from the U.S., Europe, and Asia)
• Purpose: Strategic presentation at the ‘Asia Tech Tour 2025’ sponsored by global powerhouse Goldman Sachs to accelerate international capital inflow and elevate global technology visibility.
• Format: Face-to-Face Group Meetings
• Key Presentation Summary (Strategic Blueprints for 2026 Global Growth):
  1. Full-Scale Diversification of TC Bonder Deployment: Expanding beyond standard memory HBM tools to encompass high-performance ‘Graphic DDR’ and advanced NAND-stacking ‘HBF (High Bandwidth Flash)’ architectures to capture the entire cross-industry stacked memory ecosystem.
  2. Preemptive Response to AI Packaging Architectural Shifts: Detailing precise development schedules for the custom-engineered ‘Wide TC Bonder’, designed specifically to handle expanding lateral chip die form factors in the next-generation AI hardware super-cycle.

📈 2. [Expert View: Market & Stock Price Impact Analysis]

• Securing Long-Only Western Capital via Goldman Sachs Network (Powerful Near-Term Catalyst): Serving as a headline player at Goldman Sachs’ elite institutional Tech Tour—the primary gateway for large global funds structuring their year-end and early-year allocations—is an exceptional technical catalyst. Actively presenting their high-margin growth thesis directly to international asset managers will serve as a prominent bullish driver to expand foreign ownership density and trigger aggressive foreign net buying.
• Structural Metamorphosis into a Global Tech Infrastructure Leader (Long-Term Fundamental Expansion): The fundamental strength of this filing lies in its clear technological response to cyclical single-sector peak anxieties. Formally expanding its tool application footprint into Graphic DDR and HBF domains alongside clear roadmaps for the ‘Wide TC Bonder’ guarantees that Hanmi’s near-monopoly positioning will extend deep into the next-gen advanced packaging cycle. Crucially, addressing the physical form factor scaling of future AI chips redefines the equity’s core identity. Transitioning from a single memory-tool provider to a global AI tech infrastructure titan provides international research firms with clear justification to re-rate long-term valuation multiples higher.

📝 Editor’s Comment (by K-STOCK Editor)

Hanmi Semiconductor’s strategic engagement with Goldman Sachs’ premium institutional channel is a calculated move to capture high-velocity global liquidity and anchor foreign sentiment ahead of the 2026 fiscal block. The core value of this briefing lies in giving international asset managers explicit visibility into its next-gen architecture, framing its ‘Wide TC Bonder’ as a unified solution to the evolving physical bottlenecks of advanced packaging. By establishing an aggressive tool pipeline to defend its technological moat while simultaneously diversifying shipments into high-margin graphic and flash sub-sectors, Hanmi establishes an incredibly robust two-track strategy. Complemented by secular multi-market expansion, Hanmi is systematically reinforcing its financial downside protection. Tracking this high-profile institutional asset accumulation remains the most rational approach.

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