[Disclosure] Hanmi Semiconductor (042700) Hits Wall Street! Lands in New York with Merrill Lynch to Pitch ‘U.S.-Led AI Semiconductor Alliance’

Source Fact: Financial Supervisory Service Electronic Disclosure System (DART) / 2026-06-05

Disclosure Type: Holding of Investor Relations (IR) (Announcement Disclosure)

💡 3-Second Summary

Heading straight into the heart of global capital, Hanmi Semiconductor is participating in a major New York conference to pitch its inclusion in the U.S.-led ‘AI Semiconductor Alliance’ and its next-gen tech pipeline directly to Wall Street’s institutional whales.

📊 1. [Key Disclosure Content & Major Figures Summary]

• Date & Location: June 8 ~ June 10, 2026 (3-day event), New York, USA
• Target Attendees: Major overseas institutional investors
• Purpose: Participation in the ‘2026 Asia Conference in New York’ sponsored by global investment banking titan Merrill Lynch to accelerate overseas capital inflow and enhance global shareholder alignment.
• Format: One-on-One and Group Meetings
• Key Presentation Summary (3 Core Global AI Strategies):
  1. Expanding into the AI System Semiconductor Market: Introducing high-spec ‘2.5D Package TC Bonders (Models 40 & 120)’ targeting Foundry and OSAT clients.
  2. Capturing the HBF (High Bandwidth Flash) Sector: Debuting an entirely new concept in TC bonding infrastructure designed for diversifying AI memory demands.
  3. Joining the U.S.-Led AI Semiconductor Alliance: Securing a critical foothold as a primary packaging equipment supplier within the U.S.-centric AI ecosystem linking Big Tech, foundries, and memory giants.

📈 2. [Expert View: Market & Stock Price Impact Analysis]

• Wall Street Capital Alignment in New York (Short-term Positive Catalyst): This IR roadshow is qualitative distinct because it takes place directly in New York, facing Wall Street’s largest long-only global funds. Actively selling their thesis of joining the “U.S.-led AI Semiconductor Alliance” directly to American institutions serves as a prominent bullish catalyst to expand foreign ownership and trigger foreign net buying in the short term.
• Cementing Status as a Vital Supply Chain Beneficiary (Long-term Fundamental Expansion): Showcasing foundry/OSAT-bound 2.5D package bonders and next-gen HBF bonders proves Hanmi is successfully diversifying beyond traditional memory sectors. Becoming a formal packaging equipment partner within the U.S.-led tech alliance opens the door for massive structural orders down the line as localized manufacturing ramps up. Sponsored by Merrill Lynch on U.S. soil, this event provides institutional firms with strong justification to re-rate Hanmi’s valuation multiple away from domestic peers and toward premium global equipment leaders.

📝 Editor’s Comment (by K-STOCK Editor)

Hanmi Semiconductor is scaling up the playground big time, taking the fight directly to the capital of global finance—Wall Street! Backed by Merrill Lynch hosting the stage in New York, Hanmi is walking straight up to global tier-1 whales to flex its role in the ‘U.S.-led AI Semiconductor Alliance’. This isn’t just local hype anymore; they are stepping into the ring with mega-caps like Nvidia and TSMC. Armed with new foundry-bound 2.5D package bonders and a mysterious ‘HBF (High Bandwidth Flash)’ tool pipeline, this is a flawless U.S. expansion narrative that global trading boards and tech subreddits will absolutely eat up. As the New York conference kicks off on June 8, the global institutional market vibe is bound to get scorching hot.

📢 Disclaimer & Source Information

• Source: This content was newly structured and written based on official data submitted to the Financial Supervisory Service Electronic Disclosure System (DART).
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