Skip to content

K-Stock Briefing

https://kstockbriefing.com

  • About Us
  • Weekly News
  • IR Room
  • RESEARCH
    • Semiconductors
  • Disclosures
    • Semiconductors
    • Energy
    • Bio & Healthcare
    • Defense
    • Shipbuilding
    • Automotive
  • Toggle search form
  • [Research] SK hynix (000660 / SKHY) – Daishin Securities | High-End Competitiveness · 2Q Growth Resumption · Target Price Raised / 2025-01-24 RESEARCH
  • [Disclosure] Wonik IPS (240810) – Change in Revenue or Income Structure Exceeding 30% (15% for Large Corporations) / 2026-02-25 Semiconductors
  • [Disclosure] ALTEOGEN (196170) – Decision on Paid-in Capital Increase (Third-Party Allotment – Redeemable Convertible Preferred Shares) / 2025-02-04 Disclosures
  • [Disclosure] Hanwha Aerospace (012450) – Pre-announcement of Financial Results / 2025-01-13 Disclosures
  • [Disclosure] Hanwha Ocean (042660) – Decision on Guarantees for Debt of Others / 2024-11-21 Disclosures
  • [Disclosure] Hanwha Ocean (042660) – Single Sales/Supply Contract / 2024-03-25 Disclosures
  • [Disclosure] Samsung Electronics (005930) – Change of Listing (Retirement of Shares) / 2026-04-09 Semiconductors
  • [Disclosure] Samsung Electro-Mechanics (009150) – Investor Relations (IR) Schedule Announcement / 2024-10-10 Semiconductors

[Disclosure] Hanmi Semiconductor (042700) – Investor Relations (IR) Presentation / 2025-01-31

Posted on January 31, 2025August 1, 2026 By K-STOCK Editor

Fact Source: Financial Supervisory Service DART

💡 3-Second Summary

The company will hold a conference call IR session for major overseas institutional investors across the Americas, Europe, and Asia to present its Q4 2024 operating performance, 2025 outlook, and next-generation HBM bonder development roadmaps.

📊 [Key Disclosure Contents & Summary of Major Figures]

  • Date & Time: February 04, 2025 (Specific time not specified)
  • Location: Conference Call
  • Target Audience: Major Overseas Institutional Investors (Americas, Europe, Asia, etc.)
  • Purpose: Announcement of Q4 2024 Business Performance and 2025 Outlook
  • Format: Conference Call
  • Sponsoring Institution: Macquarie Securities
  • Key Presentation Content (Summary):
    • Q4 2024 Business Performance Review, 2025 Outlook
    • Next-Generation HBM Production Bonder (Development roadmap for Fluxless TC Bonder, Hybrid Bonder)
    • New Product Lineup (2.5D Package TC Bonder for AI Big Die, EMI Shield and Grinder for satellite communications and smart devices, MSVP for glass substrate cutting)
  • Board Resolution/Decision Date: January 31, 2025
  • IR Materials: Date and URL not specified
  • Other Material Details: Schedule subject to change based on company circumstances

📝 Editor’s Comment (Key Follow-up Checkpoint)

📌 IR Event Execution and Publication of Related Materials

This filing provides notice of an upcoming conference call aimed at reviewing Q4 2024 financial results and explaining business perspectives for 2025 to global institutional investors. Tracking whether presentation documents or summary updates are officially published following the event is important to verify disclosed performance metrics and product roadmaps. Relevant information can be verified in subsequent official corporate disclosures, annual business reports, or through the official company website.

📢 Legal Disclaimer & Source Notice

Source: This content was structured and newly generated based on official filing data from the Financial Supervisory Service DART system.

Investment Risk Warning: This content is provided strictly for informational and language reference purposes only. Under no circumstances does it constitute financial advice or a recommendation to buy or sell any specific stock. All investment decisions and financial responsibilities rest entirely with the investor.

Contact: For compliance inquiries or copyright requests, please contact ksb220805@gmail.com.

Search by
Company Name or Stock Ticker.
Semiconductors, Disclosures

Post navigation

Previous Post: [Research] Samsung Electro-Mechanics (009150) – Kiwoom Securities | AI Server MLCC · China Trade-In Subsidy · FC-BGA & Silicon Capacitor / 2025-01-31
Next Post: [Disclosure] Hanmi Semiconductor (042700) – Provisional Operating Results on a Consolidated Basis (Fair Disclosure) / 2025-01-31

Related Posts

  • [Disclosure] Hanwha Aerospace (012450) – Investor Relations (IR) Holding / 2024-02-07 Disclosures
  • [Disclosure] Samsung Biologics (207940) – Investor Relations (IR) Holding Notice / 2025-05-28 Disclosures
  • [Disclosure] Hanwha Aerospace (012450) – (Corrected) Decision on Corporate Split / 2024-07-17 Disclosures
  • [Disclosure] Jeju Semiconductor(080220) – Results of General Meeting of Shareholders / 2025-03-26 Semiconductors
  • [Disclosure] KEPCO (015760 / KEP) – Results of Extraordinary General Meeting of Shareholders / 2026-04-27 Disclosures
  • [Disclosure] Samsung Biologics (207940) – (Correction) Single Sales and Supply Contract / 2025-11-13 Disclosures
  • [Disclosure] Hyundai Motor (005380) – Status of Compliance Program (CP) Operation / 2024-01-25 Disclosures
  • [Research] Samsung Electro-Mechanics (009150) – Shinhan Securities | High-Value Mix Expansion · Rising FC-BGA Share · Valuation Re-rating / 2025-08-01 RESEARCH
  • [Disclosure] Daeduck Electronics (353200) – Results of General Shareholders Meeting / 2026-03-26 Disclosures
  • [Disclosure] Hanwha Ocean (042660) – Sales and Supply Contract / 2025-07-22 Disclosures
  • [Disclosure] Hanwha Aerospace(012450) – Other Information and Notices / 2026-05-12 Disclosures
  • [Research] Samsung Electro-Mechanics (009150) – Daishin Securities | 3Q Solid Results · AI & Automotive Mix · 2025 Profit Recovery / 2024-10-30 RESEARCH
  • [Disclosure] SK hynix (000660 / SKHY) – Decision on Closure of Shareholders’ Register (Record Date) for Cash/In-Kind Dividend / 2025-07-23 Semiconductors
  • [Research] Samsung Electronics (005930) – IBK Investment & Securities | DS Earnings · Datacenter LTA · HBM4 Ramp / 2026-07-31 RESEARCH

Copyright © 2026 K-Stock Briefing.

Powered by PressBook News Dark theme