Fact Source: Financial Supervisory Service DART
💡 3-Second Summary
The company will hold an IR session in Seoul for major overseas institutional investors by participating in the ‘Tech Tour’ sponsored by Nomura Securities to share its 2025 AI/HBM market outlook, next-generation HBM bonder roadmap, and new product lineup.
📊 [Key Disclosure Contents & Summary of Major Figures]
- Date & Time: February 11, 2025 at 14:45
- Location: Seoul
- Target Audience: Major Overseas Institutional Investors
- Purpose: Participation in Nomura Securities ‘Tech Tour’
- Method: Group Meeting
- Sponsoring Institution: Nomura Securities
- Key Presentation Content (Summary):
- 2025 AI (HBM) Market Outlook (HBM market trends and outlook related to DeepSeek release)
- Next-Generation HBM Production Bonder Release Roadmap (Fluxless TC Bonder, Hybrid Bonder)
- New Product Lineup (2.5D Package TC Bonder for AI Big Die, EMI Shield and Grinder for satellite communications and smart devices, MSVP for glass substrate cutting)
- Decision Date: February 10, 2025
- IR Materials: Date and URL not specified
- Other Material Details: Schedule subject to change based on company circumstances
📝 Editor’s Comment (Key Follow-up Checkpoint)
📌 IR Event Execution and Publication of Related Materials
This filing provides notice of an upcoming IR meeting aimed at introducing the company’s technology roadmap and market outlook to overseas institutional investors. Tracking whether presentation materials or summary updates are officially published following the event is important to evaluate the specifics of the announced roadmaps. Relevant updates can be verified through subsequent official corporate filings or regular business reports (quarterly, half-year, annual).
📢 Legal Disclaimer & Source Notice
Source: This content was structured and newly generated based on official filing data from the Financial Supervisory Service DART system.
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