Fact Source: Financial Supervisory Service DART
💡 3-Second Summary
The company signed a supply contract worth KRW 8.05B with Taiwan’s ASE for ‘FLIP CHIP BONDER’ semiconductor manufacturing equipment, which represents 1.44% of its recent annual revenue.
📊 [Key Disclosure Contents & Summary of Major Figures]
- Supply Contract Type: Other Production/Supply Contract (Order for ‘FLIP CHIP BONDER’ semiconductor manufacturing equipment)
- Contract Value: KRW 8,045,604,000 (USD 5,880,000 / Exchange rate: KRW 1,368.3 per USD, KEB Hana Bank initial rate on May 28)
- Recent Annual Revenue: KRW 558,917,191,547 (2024 consolidated basis)
- Contract Value to Revenue Ratio: 1.44%
- Large Enterprise Status: Not applicable
- Contracting Party: ASE [Advanced Semiconductor Engineering, Inc.]
- Relationship with Company: None
- Supply Region: Taiwan
- Contract Period:
- Start Date: May 27, 2025
- End Date: September 26, 2025 (Subject to change upon consultation with the customer)
- Contract Date: May 27, 2025
- Major Contract Terms: No down payment or advance payment
📝 Editor’s Comment (Key Follow-up Checkpoint)
📌 Fulfillment of Supply Contract and Delivery Schedule
This disclosure details an equipment supply agreement with Taiwan’s ASE, making it important to track whether the contract is executed as scheduled up to the specified end date of September 26, 2025. Monitoring potential updates to delivery timelines or contract amounts is essential to determine whether the transaction proceeds as planned. Related execution details can be verified through subsequent contract progress disclosures or regular quarterly, half-year, and annual business reports.
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Source: This content was structured and newly generated based on official filing data from the Financial Supervisory Service DART system.
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