Fact Source: Financial Supervisory Service DART
💡 3-Second Summary
Hanmi Semiconductor will participate in a conference sponsored by Merrill Lynch Securities in New York to present key business updates to major overseas institutional investors, including new equipment launches for AI system semiconductors and participation in a U.S.-led AI alliance.
📊 [Key Disclosure Contents & Summary of Major Figures]
- Event Overview
- Event Name: 2026 Asia Conference in New York
- Date & Period: 2026-06-08 ~ 2026-06-10 (Event Date: 2026-06-08)
- Location: New York, U.S.
- Sponsor: Merrill Lynch Securities
- Meeting Format: One-on-One and Group Meetings
- Target Audience: Major overseas institutional investors
- Key Presentation Topics
- Entry into AI System Semiconductor Market (Foundry, OSAT): Release of 2.5D Package TC Bonder (40/120)
- Entry into HBF (High Bandwidth Flash) Market: Release of a new concept TC Bonder responding to growing AI semiconductor memory demand
- Participation in U.S.-led AI Semiconductor Alliance: Meeting AI packaging equipment demand for big tech, memory, and foundry partners
- Resolution Date & Other Details
- Decision Date: 2026-06-05
- Note: The event schedule is subject to change depending on company circumstances.
📝 Editor’s Comment (Key Follow-up Checkpoint)
📌 Verification of Official IR Presentation Materials and Subsequent Disclosures
This IR event serves to outline major business developments, including new equipment launches and alliance participation, for major overseas institutional investors. Verifying subsequent official disclosures or presentation materials published after the event is important to confirm how the outlined information is formally communicated. Related updates can be verified through future IR presentation materials, corporate disclosures, or periodic reports.
📢 Disclaimer & Source Notice
Source: This content was structured and newly generated based on official submission data from the Financial Supervisory Service’s Data Analysis, Retrieval and Transfer System (DART).
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